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Known Good Die(KGD)

Known Good Die (KGD) product is a preferred option for custom System in Package (SiP) solutions requiring small form factor memory. Puya provides SPI NOR Flash KGD products & IIC EEPROM KGD products to meet this requirement....


Wafer-Level Chip Scale Package(WLCSP)

Wafer-Level Chip Scale Package (WLCSP) is one of the most cost-effective and space-efficient packaging options. The die size of Puya products has leading competitiveness, so Puya WLCSP is a true chip-scale package. Puya provides WLCSP SPI NOR.....


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