Mobile

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Overview

       Mobile phones have become the necessities of modern life. The larger screen and the lighter fuselage is the developing trend of mobile phones. The miniaturization of mobile phone chips is a solution conforming to the development trend of mobile phones. All Puya products have leading competitiveness in die size, especially KGD products & WLCSP products which take the size advantage of our products to the extreme.

Features

*     Design-win SPI NOR Flash with lower power consumption and wide voltage for mobile Type-C and High-speed I/F.

*     IIC EEPROM designed software write protection function and double perturbed address assignable function for CCM application.

*     Mobile displays using AMOLED, TDDI combined with various density SPI NOR Flash allow ultimate slim and low power design.


Product Portfolio

*     SPI NOR Flash

*     IIC EEPROM

*     VCM Driver




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